Highest speed in the industry INSPECTRA series meet the requests of 100% automatic inspection with high speed and high spec. from front-end to back-end of semiconductor processing.
∥OVERVIEW
INSPECTRA series are wafer inspection systems with "High speed" and "High sensitivity".
Our original "Die-to-Statistical-Image" comparison method achive the target defects detection controling process variation and overkill.
∥Lineup of INSPECTRA series
Up coming line of INSPECTRA are SR series those are achieved further development from EX-Ⅱseries receive positive feedback, TR series those have superior cost performance, and FR series those are specialized machines for after dicing process, INSPECTRA series meet the various of customers requests.
|
Wafer inspection system
INSPECTRA series Lineup
|
Feature
|
|
SR series
|
7000SR200
(2”-8”)
|
Specialized
design for "clean classs 1" such as Wafer
front-end process (Etching, Litho, CMP, CVD and so on ) required high clean class.
Contribution to process improvement with high performance of early detection
of source of trouble by process monitoring with 100% inspection.
|
|
7000SR300
(8”-12”)
|
|
3000SR200
(2”-8”)
|
Quad-speed
up than EX-Ⅱ, to prevent the spil of
defects, supporting the 100% inspection with enough required sensitivity.
Suitable for high sensitivity inspection of products such as LSI, CIS and
MEMS same as 7000SR.
|
|
3000SR300
(8”-12”)
|
|
TR series
|
3000TR200
(2”-8”)
|
Providing a
superior cost performance as a "General-purpose
equipment" with an abundance of functions.
Suitable for not only "Si" products but also Sic, GaN and GaAS, furthermore
"Compound semiconductors" and "LED".
|
|
3000TR300
(8”-12”)
|
|
FR series
|
3000FR200
(dicing ring size up to 300mm)
|
Specialized
design for "after dicing process" can do the inspection for the
diced or expanded wafer metal ring or grip ring.
|
|
3000FR300
(dicing ring size up to 450mm)
|
|
