Wafer inspection system "INSPECTRA" series
Highest speed in the industry
INSPECTRA series meet the requests of 100% automatic inspection with high speed and high spec. from front-end to back-end of semiconductor processing.

INSPECTRA series are wafer inspection systems with "High speed" and "High sensitivity".
    Our original "Die-to-Statistical-Image" comparison method achive the target defects detection controling process variation and overkill.

    ∥Lineup of INSPECTRA series
    Up coming line of INSPECTRA are SR series those are achieved further development from EX-Ⅱseries receive positive feedback, TR series those have superior cost performance, and FR series those are specialized machines for after dicing process, INSPECTRA series meet the various of customers requests.

    Wafer inspection system 
    INSPECTRA series Lineup


    SR series



    Specialized design for "clean classs 1" such as Wafer front-end process (Etching, Litho, CMP, CVD and so on ) required high clean class.
    Contribution to process improvement with high performance of early detection of source of trouble by process monitoring with 100% inspection.





    Quad-speed up than EX-, to prevent the spil of defects, supporting the 100% inspection with enough required sensitivity.
    Suitable for high sensitivity inspection of products such as LSI, CIS and MEMS same as 7000SR.



    TR series



    Providing a superior cost performance as a "General-purpose equipment" with an abundance of functions. 
    Suitable for not only "Si" products but also Sic, GaN and GaAS, furthermore "Compound semiconductors" and "LED".



    FR series


    (dicing ring size up to 300mm)

    Specialized design for "after dicing process" can do the inspection for the diced or expanded wafer metal ring or grip ring.


    (dicing ring size up to 450mm)